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Handbook of semiconductor manufacturing technology (半导体制造工艺手册 第2版)
发布日期:2007-10-21  浏览
[内容简介]
The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more.
[目次]

          Introduction to Semiconductor Devices

          Overview of Interconnect---Copper and Low-K Integration

               Introduction

               Dual Damascene Copper Integration

               Copper/Low-k Reliability

               Conclusion

          Silicon Materials

               Introduction

               Silicon Crystal Growth Processes

               Characteristics of Czochralski Silicon Growth

               Trends in Large Diameter Silicon Growth

               Wafer Preparation

               Epitaxial Growth

               Oxygen Behavior in Silicon Processing

               Other and New Applications of Silicon Materials

               Summary

          SOI Materials and Devices

               Introduction

               SOI Basics: A Tutorial

               SOI Wafer Fabrication Methods-Some Details

               Advanced Wafer Engineering

               Physical Characterization of SOI Wafers

               Electrical Characterization

               Partially-Depleted SOI MOSFETs

               Fully Depleted SOI MOSFETs

               Scaling Trends

               Multiple-Gate SOI MOSFETs

               MEMS and Photonic Applications of SOI

               Conclusions

          Surface Preparation

               RCA Clean

               Electrochemistry

               The Chemistry of Aqueous Solutions

               SC-1

               Complexing

               Particle Removal

               Particle Adhesion

               Particle Removal---Chemical Undercutting

               Particle Removal---Electrophoretic Effects and DLVO Theory

               Particle Removal---Megasonics

               Wet Chemical Etching

               Oxide Etch

               Hydrofluoric Acid and Metallic Contamination

               Defects Related to Drying

               Polysilicon Etch

               Selective Nitride Etch

               Oxide/Nitride Etch

               Bulk Organic Removal/Photoresist Strip

               Photolithography

               Sulfuric/Oxidizer Chemistry

               Reaction Mechanism

               Sulfuric/Peroxide (Piranha)

               DI/Ozone

               Surface Preparation and Cleaning for Interconnect

               Subtractive Aluminum Interconnect

               Key Subtractive Aluminum Cleaning Challenges with Associated Defects

               Copper/Low-k Dual Damascene Interconnect

               Key Cu/Low-k Challenges with Associated Defects

               Typical Defects

               Control and Monitoring of Surface Treatment Processes

          Supercritical Carbon Dioxide in Semiconductor Cleaning

               Introduction

               Supercritical Fluids

               Supercritical CO2 Cleaning Processes

               Processing Equipment

               Conclusions and Perspectives

          Ion Implantation

               Introduction

               Ion Implant Physics and Materials Science

               Applications of Ion Implantation

               Commercial Ion Implantation Equipment

               Process Control in Ion Implantation

          Dopant Diffusion

               Introduction

               Definition of Point Defects

               Thermodynamics of Defects

               Migration and Diffusion of Point Defects

               Fick's Laws of Diffusion

               Equilibrium Formulation for Dopant Diffusion

               Non-Equilibrium Formulation for Dopant Diffusion

               Diffusion in Strained Silicon

               Conclusions and Future Research

          Oxidation and Gate Dielectrics

               Introduction to Oxidation and Gate Dielectric Technology

               Oxidation Theory

               Oxidation Interactions

               Numerical Modeling of Oxidation

               Metrology of Dielectric Films

               Gate Dielectrics

               Summary

          Silicides

               Scope of the Chapter

               Introduction

               Development Trends of Salicide

               Nickel Silicide for Contacts and Interconnections

               Metal Gate and Schottky Barrier Source-Drain

               Summary

          Rapid Thermal Processing

               Introduction

               RTP System Hardware and Control Technology

               Semiconductor Processing Using RTP

               Conclusion

          Low-K Dielectrics

               Introduction

               Channel Crack Failures

               Elastic Constraint Effects

               Pattern Layout Effects

               Environmental Effects

               Conclusion

          Chemical Vapor Deposition

               Introduction: What Is CVD and Why CVD?

               Basic Aspects of CVD

               CVD System Design

               CVD Thin Films

          Atomic Layer Deposition

               Introduction

               ALD Origins

               Chemical Processes

               ALD System Technology

               Applications

               Summary of Current Status and Outlook

          Physical Vapor Deposition

               Introduction and Semiconductor Applications

               Sputtering Background and Basics

               PVD Systems

               Applications and Variations for Interconnect Applications

               Summary, Future Directions

          Damascene Copper Electroplating

               Introduction

               Fundamentals of Electroplating

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