[内容简介]
The second edition of this standard-setting handbook provides an up-to-date reference to the individual processes, equipment, and materials of semiconductor manufacturing technologies. Edited by renowned experts, this book provides graphs, tables, and formulas for easy access to information as well as extensive references for further study. This edition features new and updated chapters on silicon materials, SOI materials and devices, surface preparation, ion implantation, dopant diffusion, in-line metrology, yield modeling, photomask fabrication, failure analysis, damascene copper electroplating, rapid thermal processing, interlevel dielectrics, plasma etch, atomic layer deposition, and more.
[目次]
Introduction to Semiconductor Devices
Overview of Interconnect---Copper and Low-K Integration
Introduction
Dual Damascene Copper Integration
Copper/Low-k Reliability
Conclusion
Silicon Materials
Introduction
Silicon Crystal Growth Processes
Characteristics of Czochralski Silicon Growth
Trends in Large Diameter Silicon Growth
Wafer Preparation
Epitaxial Growth
Oxygen Behavior in Silicon Processing
Other and New Applications of Silicon Materials
Summary
SOI Materials and Devices
Introduction
SOI Basics: A Tutorial
SOI Wafer Fabrication Methods-Some Details
Advanced Wafer Engineering
Physical Characterization of SOI Wafers
Electrical Characterization
Partially-Depleted SOI MOSFETs
Fully Depleted SOI MOSFETs
Scaling Trends
Multiple-Gate SOI MOSFETs
MEMS and Photonic Applications of SOI
Conclusions
Surface Preparation
RCA Clean
Electrochemistry
The Chemistry of Aqueous Solutions
SC-1
Complexing
Particle Removal
Particle Adhesion
Particle Removal---Chemical Undercutting
Particle Removal---Electrophoretic Effects and DLVO Theory
Particle Removal---Megasonics
Wet Chemical Etching
Oxide Etch
Hydrofluoric Acid and Metallic Contamination
Defects Related to Drying
Polysilicon Etch
Selective Nitride Etch
Oxide/Nitride Etch
Bulk Organic Removal/Photoresist Strip
Photolithography
Sulfuric/Oxidizer Chemistry
Reaction Mechanism
Sulfuric/Peroxide (Piranha)
DI/Ozone
Surface Preparation and Cleaning for Interconnect
Subtractive Aluminum Interconnect
Key Subtractive Aluminum Cleaning Challenges with Associated Defects
Copper/Low-k Dual Damascene Interconnect
Key Cu/Low-k Challenges with Associated Defects
Typical Defects
Control and Monitoring of Surface Treatment Processes
Supercritical Carbon Dioxide in Semiconductor Cleaning
Introduction
Supercritical Fluids
Supercritical CO2 Cleaning Processes
Processing Equipment
Conclusions and Perspectives
Ion Implantation
Introduction
Ion Implant Physics and Materials Science
Applications of Ion Implantation
Commercial Ion Implantation Equipment
Process Control in Ion Implantation
Dopant Diffusion
Introduction
Definition of Point Defects
Thermodynamics of Defects
Migration and Diffusion of Point Defects
Fick's Laws of Diffusion
Equilibrium Formulation for Dopant Diffusion
Non-Equilibrium Formulation for Dopant Diffusion
Diffusion in Strained Silicon
Conclusions and Future Research
Oxidation and Gate Dielectrics
Introduction to Oxidation and Gate Dielectric Technology
Oxidation Theory
Oxidation Interactions
Numerical Modeling of Oxidation
Metrology of Dielectric Films
Gate Dielectrics
Summary
Silicides
Scope of the Chapter
Introduction
Development Trends of Salicide
Nickel Silicide for Contacts and Interconnections
Metal Gate and Schottky Barrier Source-Drain
Summary
Rapid Thermal Processing
Introduction
RTP System Hardware and Control Technology
Semiconductor Processing Using RTP
Conclusion
Low-K Dielectrics
Introduction
Channel Crack Failures
Elastic Constraint Effects
Pattern Layout Effects
Environmental Effects
Conclusion
Chemical Vapor Deposition
Introduction: What Is CVD and Why CVD?
Basic Aspects of CVD
CVD System Design
CVD Thin Films
Atomic Layer Deposition
Introduction
ALD Origins
Chemical Processes
ALD System Technology
Applications
Summary of Current Status and Outlook
Physical Vapor Deposition
Introduction and Semiconductor Applications
Sputtering Background and Basics
PVD Systems
Applications and Variations for Interconnect Applications
Summary, Future Directions
Damascene Copper Electroplating
Introduction
Fundamentals of Electroplating