[内容简介]
Monolithic microwave integrated circuits (MMICs) are used in a host of electronics from cellular phones and global positioning systems to missile systems and radar. They are prized for their high performance and reliability, but they can be costly and highly difficult to produce. Proper design is the key to minimizing these problems. This practical resource is filled with real-world design techniques and rules of thumb that engineers can use on the job everyday to decrease costs and improve production quality. Emphasizing practice over theory, this handy reference is filled with photos of real MMIC designs that show how design techniques have been successfully implemented in the field. In addition to circuit design, the book covers modeling, simulation, and testing, as well as selection of the appropriate production technology. This invaluable volume offers professionals a unique look into the day-to-day practices of MMIC production and the economics associated with it.
[Table Of Contents]
Foreword
Preface
1 Introduction
1.1 Introduction to MMICs
1.2 The History of MMICs
1.3 The MMIC Advantage
1.4 Basic Design Process
References
2 Component Technology and Foundry Choice
2.1 Active Components
2.1.1 Substrate Material
2.1.2 Transistor Type
2.1.3 Transistor Response Versus Frequency
2.2 Passive Components
2.2.1 Diodes
2.2.2 Transmission Lines
2.2.3 Resistors
2.2.4 Capacitors
2.2.5 Inductors
2.2.6 Metal Layer Interconnects
2.2.7 Bond-pads
2.2.8 Substrate Vias
2.3 Questions
References
3 Foundry Use and Economics
3.1 Using a Foundry
3.1.1 Agreements and Discussions
3.1.2 Delivery of Design Data
3.1.3 Circuit Design
3.1.4 Design Review
3.1.5 Wafer Fabrication
3.1.6 Test and Delivery
3.2 Economics
3.2.1 MMIC Production Costs
3.2.2 Defect Densities
References
4 Simulation and Component Models
4.1 Simulation
4.1.1 The s-parameters
4.1.2 Component Characterization
4.1.3 Model Development
4.1.4 Linear Simulation
4.1.5 Nonlinear Simulation
4.1.6 2D, 2.5D, and 3D Electromagnetic Simulation
4.2 Passive Component Models
4.2.1 Capacitors
4.2.2 Inductors
4.2.3 Resistors
4.2.4 Vias
4.2.5 Transmission-Line Discontinuities
4.3 Active Component Models
4.3.1 FET Model
4.3.2 HBT Model
4.4 Questions
References
5 Design
5.1 Impedance Matching and the Smith Chart
5.1.1 Matching
5.1.2 Smith Chart
5.1.3 Converting Impedance to Reflection Coefficient
5.1.4 Converting Impedance to Admittance
5.1.5 Deriving the Conjugate Impedance
5.1.6 Transforming a Load Impedance Along a Lossless Transmission Line
5.1.7 Addition of Series Reactive and Shunt Susceptance Lumped Elements
5.1.8 T and Pi Matching Circuits
5.1.9 Curves of Constant Q-factor
5.1.10 Circles of Constant Performance
5.2 Passive Elements
5.2.1 Open Circuit and Short Circuit Stubs
5.2.2 Radial Stubs
5.2.3 Couplers, Splitters, and Combiners
5.2.4 Baluns
5.2.5 Filters
5.2.6 Antennas
5.3 Amplifiers
5.3.1 Initial Considerations
5.3.2 Small-Signal Amplifiers
5.3.3 Power Amplifiers
5.4 Oscillators
5.4.1 Oscillation Principles
5.5 Mixers
5.5.1 MMIC Mixers
5.6 Switches
5.7 Phase Shifters
5.7.1 Reflective Phase Shifters
5.7.2 Loaded-Line Phase Shifters
5.7.3 Switched-Delay-Line Phase Shifters
5.7.4 Switched-Filter Phase Shifters
5.8 Switched-Path Attenuators
5.9 Circuits with Digital Application
5.9.1 Prescalers
5.9.2 Logarithmic Amplifiers
5.9.3 Darlington Pair Amplifiers
5.10 Millimeter-Wave Circuits
5.10.1 High-Frequency Effects
5.10.2 Component Choice
5.10.3 Simulation Issues
5.11 Yield Improvement
5.11.1 What Is the MMIC Yield?
5.11.2 Yield-Improvement Techniques
5.12 Questions
References
6 Layout
6.1 Layout Files
6.2 Circuit Layout Process
6.3 Layout Checking
6.3.1 Layout Design Rules
6.3.2 Design Rule Checking
6.3.3 Electrical Rule Checking
6.3.4 Layout Versus Schematic
6.3.5 Reverse Engineering
6.3.6 Visual Checking
6.4 Chip Arraying
6.4.1 Chip Identifiers
6.4.2 Arraying Guidelines
6.5 Mask Manufacture
6.6 Layout Examples
6.7 Questions
References
7 Processing Technology
7.1 Substrate Material Growth
7.2 Wafer Production
7.3 Surface Layers
7.4 Photolithography
7.4.1 Typical MMIC Photolithographic Steps
7.4.2 Device Isolation
7.4.3 Ohmic Contacts
7.4.4 Gate Contacts
7.4.5 First Interconnect Metal
7.4.6 High-Dielectric-Constant Layer
7.4.7 Resistive Metal
7.4.8 Low-Dielectric-Constant Layer
7.4.9 Second Interconnect Metal
7.4.10 Dielectric Encapsulation and Saw/Scribe Lane Definition
7.5 Wafer Thinning
7.6 Through-Substrate Vias
7.7 Back-Face Metal
7.8 Chip Separation
7.9 Quality Assurance
7.10 Questions
References
8 Test
8.1 Process Control and Monitoring (PCM)
8.2 The dc Test and Stability Problems
8.3 RF Testing and Calibration
8.4 Questions
References
Appendix: Answers to Questions
Chapter 2
Chapter 4
Chapter 5
Chapter 6
Chapter 7
Chapter 8
Glossary
About the Author
Index
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