[内容简介]
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.
The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:
- Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
- Supplies state-of-the-art solutions for challenges unique to 3D circuit design
- Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
[目录]
3D INTEGRATION OVERVIEW
2.5D/3D ICs: Drivers, Technology, Applications, and Outlook
Chuan Seng Tan
Overview of Physical Design Issues for 3D-Integrated Circuits
Aida Todri-Sanial
Detailed Electrical and Reliability Study of Tapered TSVs
Tiantao Lu and Ankur Srivastava
3D Interconnect Extraction
Sung Kyu Lim
PHYSICAL DESIGN METHODS FOR 3D INTEGRATION
3D Placement and Routing
Pingqiang Zhou and Sachin S. Sapatnekar
Power and Signal Integrity Challenges in 3D Systems-on-Chip
Emre Salman
Design Methodology for TSV-Based 3D Clock Networks
Taewhan Kim and Heechun Park
Design Methodology for 3D Power Delivery Networks
Aida Todri-Sanial
RELIABILITY CONCERNS FOR 3D INTEGRATION
Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
Yu-Guang Chen, Yiyu Shi, and Shih-Chieh Chang
Thermal Modeling and Management for 3D Stacked Systems
Tiansheng Zhang, Fulya Kaplan, and Ayse K. Coskun
Exploration of the Thermal Design Space in 3D Integrated Circuits
Sumeet S. Kumar, Amir Zjajo, and Rene van Leuken
Exploration of the Thermal Design Space in 3D Integrated Circuits
Nizar Dahir, Ra’ed Al-Dujaily, Terrence Mak, and Alex Yakolev
TSV-to-Device Noise Analysis and Mitigation Techniques
Brad Gaynor, Nauman Khan, and Soha Hassoun
CAD DESIGN TOOLS AND FUTURE DIRECTIONS FOR 3D PHYSICAL DESIGN
Overview of 3D CAD Design Tools
Andy Heinig and Robert Fischbach
Design Challenges and Solutions for Monolithic 3D ICs
Sung Kyu Lim and Yiyu Shi
Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs
Tony Tae-Hyoung Kim and Aung Myat Thu Linn
Challenges and Future Directions of 3D Physical Design
Johann Knechtel, Jens Lienig, and Cliff C.N. Sze
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